EcorelTM Free 305-1-85 is a lead free solder paste constituted with tin-silver-copper with respectively 3 or 4 % of silver. It presents a rheology adapted to the different systems of application by dots, no end screw or direct pressure. It delivers reproducible volumes from dot to dot all along the application.

Description

• Alloy SnAg3Cu0.5
• Aplication by dots
• Syringes 30g and 100g
• Flux classification L0